Double Sided Tape for Polishing Pad
Yih Hwa Double Sided Tape is a specially designed for the application of polishing pads in the wafer backgrinding machine. It is engineered to adhere the polishing pad to the grinding equipment securely and removes cleanly without residue.
Yih Hwa Double-Sided Tape is a high-precision adhesive solution engineered specifically for polishing pads of wafer backgrinding machines. Designed to bond polishing pads securely to grinding equipment, it features differential adhesives on both sides for optimal performance and clean removal – making it ideal for semiconductor and microelectronics manufacturing environments.
Key Features
High Temperature Resistance: Maintains strong adhesion under extreme heat, ensuring consistent performance during thermal-intensive grinding processes
Chemical Resistance: Withstands exposure to grinding fluids and process chemicals without degradation
Clean Removal: Leaves no residue, simplifying post-process cleanup and reducing downtime
Strong Adhesion: Prevents slippage or misalignment of polishing pads, supporting high-precision operations
Applications
Wafer backgrinding and polishing
Semiconductor fabrication
Precision equipment bonding
Technical Data
Backing: Tissue
Adhesive: Acrylic Adhesive
Overall Thickness: 100 ± 5mic
Peel Adhesion: 10 ± 2N/24mm
Temperature Resistance: 8 - 38°C
