Double Sided Tape for Polishing Pad

Yih Hwa Double-Sided Tape is a high-precision adhesive solution engineered specifically for polishing pads of wafer backgrinding machines. Designed to bond polishing pads securely to grinding equipment, it features differential adhesives on both sides for optimal performance and clean removal – making it ideal for semiconductor and microelectronics manufacturing environments.

Key Features:

• High Temperature Resistance: Maintains strong adhesion under extreme heat, ensuring consistent performance during thermal-intensive grinding processes
• Chemical Resistance: Withstands exposure to grinding fluids and process chemicals without degradation
• Clean Removal: Leaves no residue, simplifying post-process cleanup and reducing downtime
• Strong Adhesion: Prevents slippage or misalignment of polishing pads, supporting high-precision operations

Applications:

• Wafer backgrinding and polishing
• Semiconductor fabrication
• Precision equipment bonding