Thermal Pad
YWT-261KST is a thermal conductive silca gel pad. It is a thermal conductive mdium material that is synthesized by a special process
The product consists of a release layer, thermal conductive silica gel pad with a layer of PET. The material is soft with good compression performance, excellent thermal conductivity and has great insulation performance. It is also easy to install, test and can be reused. YWT-261KST thermal pad is suitable for use in electronic and electical products such as control motherboard, electronic and electrical appliances, automotive machinery, computer mainframe, laptops, etc.
Technical Data
Backing: PET
Adhesive: Thermal Conductive Silica Gel
Overall Thickness: 0.25 – 10mm
