Double Sided Tape for Wafer Backgrinding Machine

Yih Hwa Double Sided Tape is a high precision and reliable option specially designed for the application of the wafer backgrinding machine. It is engineered to adhere the polishing pad to the grinding equipment securely and removes cleanly thanks to the speicially formulated differential adhesives on both sides.

Key Features:

• High Temperature Resistance: Our tape can withstand extreme temperatures without losing its adhesion, ensuring consistent performance even under intense heat conditions
• Chemical Resistance: Yih Hwa double sided tape can endure exposure to various chemicals and heat produced during the grinding process
• Clean Removal: It is designed for clean and easy removal without leaving residue, making post-process cleanup simple and hassle-free
• Strong Adhesion: offers excellent bonding to ensure the polishing pad remains securely attached to the equipment, preventing any slippage or misalignment during operation